Kara Stack — Thermal Simulator

Demo scenarios

❄ cooling

▲ device die · heat source

Tj —°C

Copper

✓ in range

—

cooler junction

❄ cooling

▲ device die · heat source

Tj —°C

Diamond

✓ in range

Heat rises from the device (bottom) to cooling (top); the ◆ KARA diamond layer spreads it. Try a scenario above, drag the power throttle to stress-test, or scrub any material below.

⚡ Power throttle

700 W

Model — slide through devices

—

Baseline material

—

Kara material

—

Die interface · TIM both stacks

—

what diamond saves

—

Cumulative value over 5 years — the fleet number, paid back and compounding

—

net, year 5

Kara cumulative net Baseline (break-even line)

Heat-flow cross-section — drag to compare

drag the divider to wipe between your stack and the Kara stack

Your stack

Kara

⇄

Baseline vs Kara

computed for the selected model & materials

Metric	Baseline	Kara	Change

What’s the bottleneck?

resistance by layer · bottleneck flagged

Transient — pulsed power

Z_th(t) warm-up from the stack R·C · diamond lowers the peak under a pulse

Pulse width

Duty cycle

BaselineKarasteady Rθ

Baseline peak Tj / pulse

— °C

Kara peak Tj / pulse

— °C

Confidence & sensitivity

Kara Tj · which unknown moves it most

—°C ± range —

Integration & bonding

a configurable starting point — not a final process